This research suggests a multilayer printed circuit board technique for an air-filled substrate integrated waveguide (SIW).
It is particularly relevant for millimeter-wave applications, which often call for low cost, low loss, and great power handling performance. This three-layered, air-filled SIW enables significant loss reduction and improved power handling. A extremely compact, high-performance, low-cost, and self-packaged millimeter-wave integrated system can be created by using FR-4 as the baseband or digital circuits in the top and bottom layers of the system. It is demonstrated that over Ka-band (U-band), the air-filled SIW reduces losses by a mean value of 0.068 dB/cm in comparison to its dielectric-filled counterparts based on Rogers substrates RT/Duroid 5880 and likewise 6002.
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