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Which of the following best describes electroplating?
A Forcing a nonspontaneous reaction
B. Depositing one metal on another
c
C Tuming a metal Jions
D. Reversing the flow of electrons

Respuesta :

Answer:

The answer is Depositing one metal on another

Explanation:

Depositing one metal on another best describes electroplating. Hence, option B is correct.

What is electroplating?

"Electroplating is a process that uses an electric current to reduce dissolved metal cations so that they form a thin coherent metal coating on an electrode."

An electroplating process is the electroplating of copper in which the metal to be plated (copper) is used as the anode, and the electrolyte solution contains the ion of the metal to be plated (Cu2+). Copper in the solution at the anode and is plated at the cathode.

Electroplating is primarily used to change the physical properties of the materials. This process can be used to give materials increased wear resistance, corrosion protection or aesthetic appeal, as well as increased thickness.

Hence, depositing one metal on another best describes electroplating.

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