As a process engineer working in the clean room or a foundry, you are tasked with an assignment to characterize the mechanical properties of LPCVD polysilicon film deposited by the new LPCVD tool. The process parameters are deposition pressure and temperature. SiH4 diluted with H2 is used as a process gas. The mechanical properties include Young’s Modulus, Average Stress, Stress Gradient, Poisson ratio, and Yield Strength. Propose strategies (methods) on how you may be able to achieve your objective.
